| Substrate | Target | Coating Layer | Application | Characteristics | BUWON Products |
|---|---|---|---|---|---|
| Glass | ITO | ITO | • Resistance | • High light transmittance • Decrease resistance with thickness |
• TP：200~500ohm • TN/STN：24~200ohm • IMITO Index match: conductive layer • EC mirror conductive layer |
| Nb | NbOx | • Optical | • High refractive optical film layer, non-conductive | • TP : Optical Layer Application • IMITO: Optical Layer Application • AR : Optical Layer Application • IR : Optical Layer Application • Half mirror |
|
| Si | SiO2 | • Optical | • Low refractive optical film layer, non-conductive | • TP : Bottom/Optical Layer Application • TN/STN : Bottom layer • IMITO: Index match Optical Layer • AR : Optical Layer Application • IR : Optical Layer Application • Half mirror |
|
| Si3Nx | • Optical • Insulation |
• High refractive optical film layer, non-conductive | • AR : Optical Layer Application | ||
| Cr | Cr | • Protect • Decorate |
• Conductive metal, applied as a protective or decorative layer | • EC Mirror: Decorative layer • CPT : Metal: Protective layer |
|
| Al | Al | • Resistance | • Conductive metal, applied as conductive layer | • CPT : Metal conductive layer | |
| Mo | Mo | • Protect | • Conductive metal, applied as a protective layer | • CPT: Metal Protective layer | |
| Ti | Ti | • adhesion | • Conductive metal, for improved material adhesion applications | • Cu Metal adhesion improve layer | |
| Cu | Cu | • Resistance | • Conductive metal, applied as conductive layer | • Cu Metal conductive layer | |
| Ag | Ag | • Resistance | • Conductive metal, applied as conductive layer • Highly reflective |
• EC mirror conductive layer • EC mirror reflective layer |